Change Chip Market and Technology Trends
Over the next five years, an amazing 3x wafer growth is expected pertaining to the Flip-Chip platform, which will reach 40M+ of 12''eq wspy by 2018!
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Despite its substantial 19% CAGR, Flip-chip is usually not fresh вЂ” in fact , it was initially introduced simply by IBM three decades ago! As such, it would be simple to consider it an old, uninteresting, older technologyвЂ¦but this can be far from accurate! Instead, Flip-Chip is checking up on the times and developing fresh bumping approaches to serve advanced technologies, just like 3DIC and 2 . 5D. Indeed, no matter what packaging technology you're employing, a bumping step is usually required by the end!
In 2012, bumping technologies accounted for 81% in the total installed capacity inside the middle-end place. That's big. Really big. So big that it signifies 14M+ 12''eq wafers (2012 installed capacity: see determine below) вЂ” and ok loading prices are large as well, specifically the Cu pillar platform (88%). Flip-Chip is also big on worth: in 2012 it had been a $20B market (making it the greatest market inside the middle-end area), and we proceed with the expectation that it will continue developing at an 9% clip, ultimately reaching $35B by 2018!
Flip-Chip potential is supposed to grow above the next five years to meet large require from 3 main areas: 1) CMOS 28nm IC, including new applications just like APE and BB; 2) The next generation of DDR Storage;
3) 3DIC/2. 5D Interposer using Вµbumping. Driven by simply these applications, Cu entender is coming to becoming the connect of choice to get Flip-Chip.
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- Completely updated 2010 вЂ“ 2018 market outlook and bottom-up approach, which includes micro-bumping for 3DIC! - 2012 mounted capacity
- Comparison between C2 and TCB
- Strong focus on micro-bumping pertaining to 3DIC & 2 . 5D
- Industry share/data for Flip-Chip bonder
- Thorough technology plan
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